Our series of deep dive sessions from Intel Technology Tour 2025 continues with Sr. Principal Engineer and SoC Architect Arik Gihon, who unpacks Panther Lake’s scalable architecture and its key components. This overview of the processor explains how it’s all stitched together, from internal fabrics, caching, and memory through to the Foveros technology that physically connects the tiles. Learn about the family of pin-compatible die package combinations designed to meet the needs of different devices, the new IP shared across the line, and the gains we’re seeing in both performance and efficiency.
Credit to : Intel Technology
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